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Optical interconnects
This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optic...
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Lenguaje: | eng |
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Morgan & Claypool Publishers
2006
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Acceso en línea: | http://cds.cern.ch/record/1614220 |
_version_ | 1780932345639993344 |
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author | Chen, Ray T |
author_facet | Chen, Ray T |
author_sort | Chen, Ray T |
collection | CERN |
description | This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical |
id | cern-1614220 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2006 |
publisher | Morgan & Claypool Publishers |
record_format | invenio |
spelling | cern-16142202021-04-21T22:10:16Zhttp://cds.cern.ch/record/1614220engChen, Ray TOptical interconnectsEngineeringThis book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level opticalMorgan & Claypool Publishersoai:cds.cern.ch:16142202006 |
spellingShingle | Engineering Chen, Ray T Optical interconnects |
title | Optical interconnects |
title_full | Optical interconnects |
title_fullStr | Optical interconnects |
title_full_unstemmed | Optical interconnects |
title_short | Optical interconnects |
title_sort | optical interconnects |
topic | Engineering |
url | http://cds.cern.ch/record/1614220 |
work_keys_str_mv | AT chenrayt opticalinterconnects |