Novel technologies and materials for thermal management

Efficient thermal engineering solutions for the entire heat load path from source to sink (sensor to cooling plant) are crucial for the future silicon detectors, more than even before. The particularly demanding cooling requirements are coming from the extreme radiation environment, causing high leakage current in the silicon sensors, as well as from the high power dissipated in the front-end electronics, featuring enhanced functionality and high channel count. The need to carry out dedicated R&D has encouraged increased cooperation among the HEP experiments, to identify state-of-the-art materials and construction principles that can help fulfilling the requirements, and to develop more efficient active cooling systems like CO2 cooling, which is now widely accepted as an excellent detector cooling technology.