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Front End Electronics (FEE 2014)
FEE2014 meeting will provide an opportunity to discuss the front-end electronics for future HEP experiments as well as for upgrades to existing ones, for astrophysics, medical instrumentation, photon science and in the field of CMOS Monolithic Active Pixel Sensors. The FEE2014 meeting will be an exc...
Lenguaje: | eng |
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Publicado: |
2014
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Acceso en línea: | http://cds.cern.ch/record/1634149 |
_version_ | 1780934446001684480 |
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collection | CERN |
description | FEE2014 meeting will provide an opportunity to discuss the front-end electronics for future HEP experiments as well as for upgrades to existing ones, for astrophysics, medical instrumentation, photon science and in the field of CMOS Monolithic Active Pixel Sensors. The FEE2014 meeting will be an excellent opportunity to discuss these developments and exchange new ideas.
Meeting themes will include:
- Front-end circuits and signal processing for particle physics, photon science, nuclear, medical and space applications;
- Monolithic Active Pixel Sensors (MAPS);
- Vertical integration processes and fine-pitch interconnection techniques;
- Homogeneous and heterogeneous 3D integrated circuits;
- SOI detectors;
- Deep submicron technologies and radiation tolerance. |
id | cern-1634149 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2014 |
record_format | invenio |
spelling | cern-16341492019-09-30T06:29:59Zhttp://cds.cern.ch/record/1634149engFront End Electronics (FEE 2014)FEE2014 meeting will provide an opportunity to discuss the front-end electronics for future HEP experiments as well as for upgrades to existing ones, for astrophysics, medical instrumentation, photon science and in the field of CMOS Monolithic Active Pixel Sensors. The FEE2014 meeting will be an excellent opportunity to discuss these developments and exchange new ideas. Meeting themes will include: - Front-end circuits and signal processing for particle physics, photon science, nuclear, medical and space applications; - Monolithic Active Pixel Sensors (MAPS); - Vertical integration processes and fine-pitch interconnection techniques; - Homogeneous and heterogeneous 3D integrated circuits; - SOI detectors; - Deep submicron technologies and radiation tolerance.oai:cds.cern.ch:16341492014 |
spellingShingle | Front End Electronics (FEE 2014) |
title | Front End Electronics (FEE 2014) |
title_full | Front End Electronics (FEE 2014) |
title_fullStr | Front End Electronics (FEE 2014) |
title_full_unstemmed | Front End Electronics (FEE 2014) |
title_short | Front End Electronics (FEE 2014) |
title_sort | front end electronics (fee 2014) |
url | http://cds.cern.ch/record/1634149 |