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The ATLAS Insertable B-Layer Project

The ATLAS experiment will upgrade its Pixel Detector with the installation of a new pixel layer in 2013-14. The new sub-detector, named Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radi...

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Autor principal: Miucci, A
Lenguaje:eng
Publicado: 2013
Materias:
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/9/02/C02018
http://cds.cern.ch/record/1637744
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author Miucci, A
author_facet Miucci, A
author_sort Miucci, A
collection CERN
description The ATLAS experiment will upgrade its Pixel Detector with the installation of a new pixel layer in 2013-14. The new sub-detector, named Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been de- veloped. Furthermore, the physics performance should be improved through the reduction of pixel size while a low material budget should be imposed. A new mechanical support using lightweight staves and a CO2 based cooling system is used. An overview of the IBL project and the status of the production of staves and the qualification of the assembly procedure, the loaded module electrical integrity and the read-out chain will be presented.
id cern-1637744
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2013
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spelling cern-16377442019-09-30T06:29:59Zdoi:10.1088/1748-0221/9/02/C02018http://cds.cern.ch/record/1637744engMiucci, AThe ATLAS Insertable B-Layer ProjectDetectors and Experimental TechniquesThe ATLAS experiment will upgrade its Pixel Detector with the installation of a new pixel layer in 2013-14. The new sub-detector, named Insertable B-layer (IBL), will be installed between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been de- veloped. Furthermore, the physics performance should be improved through the reduction of pixel size while a low material budget should be imposed. A new mechanical support using lightweight staves and a CO2 based cooling system is used. An overview of the IBL project and the status of the production of staves and the qualification of the assembly procedure, the loaded module electrical integrity and the read-out chain will be presented.ATL-INDET-PROC-2013-022oai:cds.cern.ch:16377442013-12-18
spellingShingle Detectors and Experimental Techniques
Miucci, A
The ATLAS Insertable B-Layer Project
title The ATLAS Insertable B-Layer Project
title_full The ATLAS Insertable B-Layer Project
title_fullStr The ATLAS Insertable B-Layer Project
title_full_unstemmed The ATLAS Insertable B-Layer Project
title_short The ATLAS Insertable B-Layer Project
title_sort atlas insertable b-layer project
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.1088/1748-0221/9/02/C02018
http://cds.cern.ch/record/1637744
work_keys_str_mv AT miuccia theatlasinsertableblayerproject
AT miuccia atlasinsertableblayerproject