Vertex-Detector R&D for CLIC

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A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors via low-mass interconnects. The power dissipa...

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Autor principal: Dannheim, Dominik
Lenguaje:eng
Publicado: 2013
Materias:
Particle Physics - Experiment
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/9/03/C03026
http://cds.cern.ch/record/1639547
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author Dannheim, Dominik
author_facet Dannheim, Dominik
author_sort Dannheim, Dominik
collection CERN
description A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors via low-mass interconnects. The power dissipation of the readout chips is reduced by means of power pulsing, allowing for a cooling system based on forced gas flow. In this paper the CLIC vertex-detector requirements are reviewed and the current status of R&D on sensors, readout and detector integration is presented.
id cern-1639547
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2013
record_format invenio
spelling cern-16395472023-03-14T17:48:55Zdoi:10.1088/1748-0221/9/03/C03026http://cds.cern.ch/record/1639547engDannheim, DominikVertex-Detector R&D for CLICParticle Physics - ExperimentDetectors and Experimental TechniquesA detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors via low-mass interconnects. The power dissipation of the readout chips is reduced by means of power pulsing, allowing for a cooling system based on forced gas flow. In this paper the CLIC vertex-detector requirements are reviewed and the current status of R&D on sensors, readout and detector integration is presented.A detector concept based on hybrid planar pixel-detectortechnology is under development for the CLIC vertex detector. Itcomprises fast, low-power and small-pitch readout ASICs implementedin 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors vialow-mass interconnects. The power dissipation of the readout chipsis reduced by means of power pulsing, allowing for a cooling systembased on forced gas flow. In this paper the CLIC vertex-detectorrequirements are reviewed and the current status of R&D on sensors,readout and detector integration is presented.A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors via low-mass interconnects. The power dissipation of the readout chips is reduced by means of power pulsing, allowing for a cooling system based on forced gas flow. In this paper the CLIC vertex-detector requirements are reviewed and the current status of R&D on sensors, readout and detector integration is presented.arXiv:1312.5774CLICDP-CONF-2013-006oai:cds.cern.ch:16395472013-12-20
spellingShingle Particle Physics - Experiment
Detectors and Experimental Techniques
Dannheim, Dominik
Vertex-Detector R&D for CLIC
title Vertex-Detector R&D for CLIC
title_full Vertex-Detector R&D for CLIC
title_fullStr Vertex-Detector R&D for CLIC
title_full_unstemmed Vertex-Detector R&D for CLIC
title_short Vertex-Detector R&D for CLIC
title_sort vertex-detector r&d for clic
topic Particle Physics - Experiment
Detectors and Experimental Techniques
url https://dx.doi.org/10.1088/1748-0221/9/03/C03026
http://cds.cern.ch/record/1639547
work_keys_str_mv AT dannheimdominik vertexdetectorrdforclic

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