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Report on SI-IT Prototype Modules R&D for the LHCb Upgrade
New Si-IT prototypes for the LHCb Upgrade were developed and assembled using aluminium flexible microcables. The modules are based on Hamamatsu single sided microstrip sensors 320 and 410 μm thick with 198 μm strip pitch. Beetle chips were used to readout the sensors. The testing was carried out at...
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
2014
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| Acceso en línea: | http://cds.cern.ch/record/1647821 |