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Characterization of Thin Pixel Sensor Modules Interconnected with SLID Technology Irradiated to a Fluence of 2⋅10 15 $n_{eq}$ /cm 2

A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out via Inter Chip Vias (ICV) etched through the front-end. Thi...

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Detalles Bibliográficos
Autores principales:	Weigell, P, Andricek, L, Beimforde, M, Macchiolo, A, Moser, H G, Nisius, R, Richter, R H
Formato:	info:eu-repo/semantics/article
Lenguaje:	eng
Publicado:	JINST 2011
Materias:	Detectors and Experimental Techniques 3: Microelectronics and interconnection technology 3.2: 3D Interconnection
Acceso en línea:	http://cds.cern.ch/record/1694322

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