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Electromigration in thin films and electronic devices: materials and reliability

Detalles Bibliográficos
Autor principal: Kim, Choong-Un
Lenguaje:eng
Publicado: Woodhead Publ. 2011
Materias:
Acceso en línea:http://cds.cern.ch/record/1704864
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author Kim, Choong-Un
author_facet Kim, Choong-Un
author_sort Kim, Choong-Un
collection CERN
id cern-1704864
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2011
publisher Woodhead Publ.
record_format invenio
spelling cern-17048642021-04-21T20:59:46Zhttp://cds.cern.ch/record/1704864engKim, Choong-UnElectromigration in thin films and electronic devices: materials and reliabilityEngineeringWoodhead Publ.oai:cds.cern.ch:17048642011
spellingShingle Engineering
Kim, Choong-Un
Electromigration in thin films and electronic devices: materials and reliability
title Electromigration in thin films and electronic devices: materials and reliability
title_full Electromigration in thin films and electronic devices: materials and reliability
title_fullStr Electromigration in thin films and electronic devices: materials and reliability
title_full_unstemmed Electromigration in thin films and electronic devices: materials and reliability
title_short Electromigration in thin films and electronic devices: materials and reliability
title_sort electromigration in thin films and electronic devices: materials and reliability
topic Engineering
url http://cds.cern.ch/record/1704864
work_keys_str_mv AT kimchoongun electromigrationinthinfilmsandelectronicdevicesmaterialsandreliability