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Electromigration in thin films and electronic devices: materials and reliability
Autor principal: | |
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Lenguaje: | eng |
Publicado: |
Woodhead Publ.
2011
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Materias: | |
Acceso en línea: | http://cds.cern.ch/record/1704864 |
_version_ | 1780936448012189696 |
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author | Kim, Choong-Un |
author_facet | Kim, Choong-Un |
author_sort | Kim, Choong-Un |
collection | CERN |
id | cern-1704864 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2011 |
publisher | Woodhead Publ. |
record_format | invenio |
spelling | cern-17048642021-04-21T20:59:46Zhttp://cds.cern.ch/record/1704864engKim, Choong-UnElectromigration in thin films and electronic devices: materials and reliabilityEngineeringWoodhead Publ.oai:cds.cern.ch:17048642011 |
spellingShingle | Engineering Kim, Choong-Un Electromigration in thin films and electronic devices: materials and reliability |
title | Electromigration in thin films and electronic devices: materials and reliability |
title_full | Electromigration in thin films and electronic devices: materials and reliability |
title_fullStr | Electromigration in thin films and electronic devices: materials and reliability |
title_full_unstemmed | Electromigration in thin films and electronic devices: materials and reliability |
title_short | Electromigration in thin films and electronic devices: materials and reliability |
title_sort | electromigration in thin films and electronic devices: materials and reliability |
topic | Engineering |
url | http://cds.cern.ch/record/1704864 |
work_keys_str_mv | AT kimchoongun electromigrationinthinfilmsandelectronicdevicesmaterialsandreliability |