3D active edge silicon sensors: Device processing, yield and QA for the ATLAS-IBL production

3D silicon sensors, where plasma micromachining is used to etch deep narrow apertures in the silicon substrate to form electrodes of PIN junctions, were successfully manufactured in facilities in Europe and USA. In 2011 the technology underwent a qualification process to establish its maturity for a...

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Detalles Bibliográficos
Autores principales: Da Via, Cinzia, Boscardil, Maurizio, Dalla Betta, GianFranco, Fleta, Celeste, Giacomini, Gabriele, Hansen, Thor-Erik, Hasi, Jasmine, Kok, Angela, Micelli, Andrea, Povoli, Marco, Vianello, Elisa, Zorzi, Nicola, Watts, S.J, Grenier, Philippe, Grinstein, Sebastian, Darbo, Giovanni, Gemme, Claudia, Kenney, Christopher, La Rosa, Alessandro, Parker, Sherwood, Pohl, David-Leon, Pellegrini, Giulio
Publicado: 2013
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2012.05.070
http://cds.cern.ch/record/1709857

Internet

https://dx.doi.org/10.1016/j.nima.2012.05.070
http://cds.cern.ch/record/1709857

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