Detectors in 3D available for assessment

This deliverable reports on 3D devices resulting from the vertical integration of pixel sensors and readout electronics. After 3D integration steps such as etching of through-silicon vias and backside metallization of readout integrated circuits, ASICs and sensors are interconnected to form a 3D pix...

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Detalles Bibliográficos
Autor principal: Re, Valerio
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: 2014
Materias:
Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Acceso en línea:http://cds.cern.ch/record/1710570
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author Re, Valerio
author_facet Re, Valerio
author_sort Re, Valerio
collection CERN
description This deliverable reports on 3D devices resulting from the vertical integration of pixel sensors and readout electronics. After 3D integration steps such as etching of through-silicon vias and backside metallization of readout integrated circuits, ASICs and sensors are interconnected to form a 3D pixel detector. Various 3D detectors have been devised in AIDA WP3 and their status and performance is assessed here.
format info:eu-repo/semantics/article
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language eng
publishDate 2014
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spelling cern-17105702019-09-30T06:29:59Z http://cds.cern.ch/record/1710570 eng Re, Valerio Detectors in 3D available for assessment Detectors and Experimental Techniques 3: Microelectronics and interconnection technology 3.2: 3D Interconnection This deliverable reports on 3D devices resulting from the vertical integration of pixel sensors and readout electronics. After 3D integration steps such as etching of through-silicon vias and backside metallization of readout integrated circuits, ASICs and sensors are interconnected to form a 3D pixel detector. Various 3D detectors have been devised in AIDA WP3 and their status and performance is assessed here. info:eu-repo/grantAgreement/EC/FP7/262025 info:eu-repo/semantics/openAccess Education Level info:eu-repo/semantics/article http://cds.cern.ch/record/1710570 2014
spellingShingle Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Re, Valerio
Detectors in 3D available for assessment
title Detectors in 3D available for assessment
title_full Detectors in 3D available for assessment
title_fullStr Detectors in 3D available for assessment
title_full_unstemmed Detectors in 3D available for assessment
title_short Detectors in 3D available for assessment
title_sort detectors in 3d available for assessment
topic Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
url http://cds.cern.ch/record/1710570
http://cds.cern.ch/record/1710570
work_keys_str_mv AT revalerio detectorsin3davailableforassessment

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