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Detectors in 3D available for assessment
This deliverable reports on 3D devices resulting from the vertical integration of pixel sensors and readout electronics. After 3D integration steps such as etching of through-silicon vias and backside metallization of readout integrated circuits, ASICs and sensors are interconnected to form a 3D pix...
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| Formato: | info:eu-repo/semantics/article |
| Lenguaje: | eng |
| Publicado: |
2014
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/1710570 |