Material studies in the frame of CLIC Accelerating structures production conducted within the Mechanics program together with Metso Oy

MeChanICs (Marie Curie Linking Industry to CERN) is an Industry to Academia Partnership and Pathways (IAPP) platform for precision manufacturing knowledge exchange bringing together five Finnish manufacturing companies with Helsinki Insitute of Physics (HIP) and CERN. The scientific objective of MeChanICs project is to contribute to the manufacturing RTD of CLIC enabling technologies. The focus is on the design, materials, machining, brazing and assembly of A CLIC accelerating structure. This study deals with the materials work package of the program and wants to explore the following items: 1) producing copper accelerating structures for CLIC from raw copper powder by near net shape hot isostatic pressing (HIP). 2) The feasibility to use HIP diffusion bonding of the accelerator structures as a function of surface quality and applied temperature and pressure. 3) Brazing for CLIC AS auxiliary systems, like water cooling or damping manifolds, to the disc stack by coating one of the brazing partners with an enabling layer prior to the heat treatment. The chosen coating method is electrodeposition of pure Cu/Au layers.