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Packaging of high power semiconductor lasers
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in hi...
| Autores principales: | , , , |
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| Lenguaje: | eng |
| Publicado: |
Springer
2014
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1007/978-1-4614-9263-4 http://cds.cern.ch/record/1953310 |
| _version_ | 1780944357599215616 |
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| author | Liu, Xingsheng Zhao, Wei Xiong, Lingling Liu, Hui |
| author_facet | Liu, Xingsheng Zhao, Wei Xiong, Lingling Liu, Hui |
| author_sort | Liu, Xingsheng |
| collection | CERN |
| description | This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed. |
| id | cern-1953310 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2014 |
| publisher | Springer |
| record_format | invenio |
| spelling | cern-19533102021-04-21T20:51:52Zdoi:10.1007/978-1-4614-9263-4http://cds.cern.ch/record/1953310engLiu, XingshengZhao, WeiXiong, LinglingLiu, HuiPackaging of high power semiconductor lasersEngineeringThis book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.Springeroai:cds.cern.ch:19533102014 |
| spellingShingle | Engineering Liu, Xingsheng Zhao, Wei Xiong, Lingling Liu, Hui Packaging of high power semiconductor lasers |
| title | Packaging of high power semiconductor lasers |
| title_full | Packaging of high power semiconductor lasers |
| title_fullStr | Packaging of high power semiconductor lasers |
| title_full_unstemmed | Packaging of high power semiconductor lasers |
| title_short | Packaging of high power semiconductor lasers |
| title_sort | packaging of high power semiconductor lasers |
| topic | Engineering |
| url | https://dx.doi.org/10.1007/978-1-4614-9263-4 http://cds.cern.ch/record/1953310 |
| work_keys_str_mv | AT liuxingsheng packagingofhighpowersemiconductorlasers AT zhaowei packagingofhighpowersemiconductorlasers AT xionglingling packagingofhighpowersemiconductorlasers AT liuhui packagingofhighpowersemiconductorlasers |