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Packaging of high power semiconductor lasers
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in hi...
| Autores principales: | , , , |
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| Lenguaje: | eng |
| Publicado: |
Springer
2014
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1007/978-1-4614-9263-4 http://cds.cern.ch/record/1953310 |