Arbitrary modeling of TSVs for 3D integrated circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth c...

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Detalles Bibliográficos
Autores principales: Salah, Khaled, Ismail, Yehea, El-Rouby, Alaa
Lenguaje:eng
Publicado: Springer 2014
Materias:
Engineering
Acceso en línea:https://dx.doi.org/10.1007/978-3-319-07611-9
http://cds.cern.ch/record/1967939

Internet

https://dx.doi.org/10.1007/978-3-319-07611-9
http://cds.cern.ch/record/1967939

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