Cargando…
Arbitrary modeling of TSVs for 3D integrated circuits
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth c...
| Autores principales: | , , |
|---|---|
| Lenguaje: | eng |
| Publicado: |
Springer
2014
|
| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1007/978-3-319-07611-9 http://cds.cern.ch/record/1967939 |