ATLAS Pixel IBL Modules Construction Experience and Developments for Future Upgrade

The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), just installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, were used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. Produ...

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Detalles Bibliográficos
Autor principal: Gaudiello, Andrea
Lenguaje:eng
Publicado: 2014
Materias:
Particle Physics - Experiment
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2015.02.033
http://cds.cern.ch/record/1969017
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author Gaudiello, Andrea
author_facet Gaudiello, Andrea
author_sort Gaudiello, Andrea
collection CERN
description The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), just installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, were used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.
id cern-1969017
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2014
record_format invenio
spelling cern-19690172019-09-30T06:29:59Zdoi:10.1016/j.nima.2015.02.033http://cds.cern.ch/record/1969017engGaudiello, AndreaATLAS Pixel IBL Modules Construction Experience and Developments for Future UpgradeParticle Physics - ExperimentThe first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), just installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, were used, connected with the new generation 130nm IBM CMOS FE-I4 readout chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.ATL-INDET-PROC-2014-014oai:cds.cern.ch:19690172014-11-12
spellingShingle Particle Physics - Experiment
Gaudiello, Andrea
ATLAS Pixel IBL Modules Construction Experience and Developments for Future Upgrade
title ATLAS Pixel IBL Modules Construction Experience and Developments for Future Upgrade
title_full ATLAS Pixel IBL Modules Construction Experience and Developments for Future Upgrade
title_fullStr ATLAS Pixel IBL Modules Construction Experience and Developments for Future Upgrade
title_full_unstemmed ATLAS Pixel IBL Modules Construction Experience and Developments for Future Upgrade
title_short ATLAS Pixel IBL Modules Construction Experience and Developments for Future Upgrade
title_sort atlas pixel ibl modules construction experience and developments for future upgrade
topic Particle Physics - Experiment
url https://dx.doi.org/10.1016/j.nima.2015.02.033
http://cds.cern.ch/record/1969017
work_keys_str_mv AT gaudielloandrea atlaspixeliblmodulesconstructionexperienceanddevelopmentsforfutureupgrade

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