Cargando…
Enable access to 3D interconnection technology
Autor principal: | Moser, H-G. |
---|---|
Formato: | info:eu-repo/semantics/article |
Lenguaje: | eng |
Publicado: |
2015
|
Materias: | |
Acceso en línea: | http://cds.cern.ch/record/1987729 |
Ejemplares similares
-
3D Interconnection with TSV
por: Moser, H-G
Publicado: (2014) -
3D interconnection processing accomplished
por: Re, V.
Publicado: (2014) -
QUALIFICATION OF ASIC AND SENSORS FOR 3D INTERCONNECTION
por: Re, Valerio
Publicado: (2013) -
Characterization of Thin Pixel Sensor Modules Interconnected with SLID Technology Irradiated to a Fluence of 2⋅10 15 $n_{eq}$ /cm 2
por: Weigell, P, et al.
Publicado: (2011) -
Test interconnection and evaluation:
por: Re, V.
Publicado: (2014)