Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC

3D technologies are investigated for the upgrade of the ATLAS pixel detector at the HL-LHC. R&D focuses on both, IC design in 3D, as well as on post-processing 3D technologies such as Through Silicon Via (TSV). The first one uses a so-called via first technology, featuring the insertion of small...

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Autores principales: Aruntinov, D, Barbero, M, Gonella, L, Hemperek, T, Hügging, F, Krüger, H, Wermes, N, Breugnon, P, Chantepie, B, Clemens, J.C, Fei, R, Fougeron, D, Godiot, S, Pangaud, P, Rozanov, A, Garcia-Sciveres, M, Mekkaoui, A
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: Nucl. Instrum. Methods Phys. Res., A 2013
Materias:
Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Acceso en línea:http://cds.cern.ch/record/1997613
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author Aruntinov, D
Barbero, M
Gonella, L
Hemperek, T
Hügging, F
Krüger, H
Wermes, N
Breugnon, P
Chantepie, B
Clemens, J.C
Fei, R
Fougeron, D
Godiot, S
Pangaud, P
Rozanov, A
Garcia-Sciveres, M
Mekkaoui, A
author_facet Aruntinov, D
Barbero, M
Gonella, L
Hemperek, T
Hügging, F
Krüger, H
Wermes, N
Breugnon, P
Chantepie, B
Clemens, J.C
Fei, R
Fougeron, D
Godiot, S
Pangaud, P
Rozanov, A
Garcia-Sciveres, M
Mekkaoui, A
author_sort Aruntinov, D
collection CERN
description 3D technologies are investigated for the upgrade of the ATLAS pixel detector at the HL-LHC. R&D focuses on both, IC design in 3D, as well as on post-processing 3D technologies such as Through Silicon Via (TSV). The first one uses a so-called via first technology, featuring the insertion of small aspect ratio TSV at the pixel level. As discussed in the paper, this technology can still present technical challenges for the industrial partners. The second one consists of etching the TSV via last. This technology is investigated to enable 4-side abuttable module concepts, using today's pixel detector technology. Both approaches are presented in this paper and results from first available prototypes are discussed.
format info:eu-repo/semantics/article
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language eng
publishDate 2013
publisher Nucl. Instrum. Methods Phys. Res., A
record_format invenio
spelling cern-19976132019-09-30T06:29:59Z http://cds.cern.ch/record/1997613 eng Aruntinov, D Barbero, M Gonella, L Hemperek, T Hügging, F Krüger, H Wermes, N Breugnon, P Chantepie, B Clemens, J.C Fei, R Fougeron, D Godiot, S Pangaud, P Rozanov, A Garcia-Sciveres, M Mekkaoui, A Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC Detectors and Experimental Techniques 3: Microelectronics and interconnection technology 3.2: 3D Interconnection 3D technologies are investigated for the upgrade of the ATLAS pixel detector at the HL-LHC. R&D focuses on both, IC design in 3D, as well as on post-processing 3D technologies such as Through Silicon Via (TSV). The first one uses a so-called via first technology, featuring the insertion of small aspect ratio TSV at the pixel level. As discussed in the paper, this technology can still present technical challenges for the industrial partners. The second one consists of etching the TSV via last. This technology is investigated to enable 4-side abuttable module concepts, using today's pixel detector technology. Both approaches are presented in this paper and results from first available prototypes are discussed. info:eu-repo/grantAgreement/EC/FP7/262025 info:eu-repo/semantics/openAccess Education Level info:eu-repo/semantics/article http://cds.cern.ch/record/1997613 Nucl. Instrum. Methods Phys. Res., A Nucl. Instrum. Methods Phys. Res., A, (2013) pp. 97-102 2013
spellingShingle Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Aruntinov, D
Barbero, M
Gonella, L
Hemperek, T
Hügging, F
Krüger, H
Wermes, N
Breugnon, P
Chantepie, B
Clemens, J.C
Fei, R
Fougeron, D
Godiot, S
Pangaud, P
Rozanov, A
Garcia-Sciveres, M
Mekkaoui, A
Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC
title Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC
title_full Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC
title_fullStr Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC
title_full_unstemmed Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC
title_short Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC
title_sort experience with 3d integration technologies in the framework of the atlas pixel detector upgrade for the hl-lhc
topic Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
url http://cds.cern.ch/record/1997613
http://cds.cern.ch/record/1997613
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