Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC

3D technologies are investigated for the upgrade of the ATLAS pixel detector at the HL-LHC. R&D focuses on both, IC design in 3D, as well as on post-processing 3D technologies such as Through Silicon Via (TSV). The first one uses a so-called via first technology, featuring the insertion of small...

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Detalles Bibliográficos
Autores principales: Aruntinov, D, Barbero, M, Gonella, L, Hemperek, T, Hügging, F, Krüger, H, Wermes, N, Breugnon, P, Chantepie, B, Clemens, J.C, Fei, R, Fougeron, D, Godiot, S, Pangaud, P, Rozanov, A, Garcia-Sciveres, M, Mekkaoui, A
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: Nucl. Instrum. Methods Phys. Res., A 2013
Materias:
Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Acceso en línea:http://cds.cern.ch/record/1997613

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