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Copper wire bonding
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cos...
Autores principales: | Chauhan, Preeti S, Choubey, Anupam, Zhong, ZhaoWei, Pecht, Michael G |
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Lenguaje: | eng |
Publicado: |
Springer
2014
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1007/978-1-4614-5761-9 http://cds.cern.ch/record/2023261 |
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