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Copper wire bonding

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cos...

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Detalles Bibliográficos
Autores principales: Chauhan, Preeti S, Choubey, Anupam, Zhong, ZhaoWei, Pecht, Michael G
Lenguaje:eng
Publicado: Springer 2014
Materias:
Acceso en línea:https://dx.doi.org/10.1007/978-1-4614-5761-9
http://cds.cern.ch/record/2023261

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