Newnes electronics assembly handbook

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Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes...

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Detalles Bibliográficos
Autor principal: Brindley, Keith
Lenguaje:eng
Publicado: Elsevier Science 2013
Materias:
Engineering
Acceso en línea:http://cds.cern.ch/record/2050218
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author Brindley, Keith
author_facet Brindley, Keith
author_sort Brindley, Keith
collection CERN
description Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are des
id cern-2050218
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2013
publisher Elsevier Science
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spelling cern-20502182020-07-16T20:01:29Zhttp://cds.cern.ch/record/2050218engBrindley, KeithNewnes electronics assembly handbookEngineeringNewnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are desElsevier Scienceoai:cds.cern.ch:20502182013
spellingShingle Engineering
Brindley, Keith
Newnes electronics assembly handbook
title Newnes electronics assembly handbook
title_full Newnes electronics assembly handbook
title_fullStr Newnes electronics assembly handbook
title_full_unstemmed Newnes electronics assembly handbook
title_short Newnes electronics assembly handbook
title_sort newnes electronics assembly handbook
topic Engineering
url http://cds.cern.ch/record/2050218
work_keys_str_mv AT brindleykeith newneselectronicsassemblyhandbook

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