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Heat sink design considerations in medium power electronic applications with long power cycles
The aim of this work is to investigate the impact of the heat sink thickness and material, as well as, of the convection coefficient of the water cooling system on the power-electronics module thermal stressing. The heat extraction capability of different thicknesses is tested. It is concluded that...
| Autores principales: | , , , |
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| Lenguaje: | eng |
| Publicado: |
2015
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1109/EPE.2015.7309150 http://cds.cern.ch/record/2057169 |