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Hybrid microcircuit technology handbook: materials, processes, design, testing and production
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, clean...
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
Noyes Publications
1998
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2136060 |
| _version_ | 1780949956714037248 |
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| author | Licari, James J Enlow, Leonard R |
| author_facet | Licari, James J Enlow, Leonard R |
| author_sort | Licari, James J |
| collection | CERN |
| description | The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will |
| id | cern-2136060 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 1998 |
| publisher | Noyes Publications |
| record_format | invenio |
| spelling | cern-21360602021-04-21T19:46:47Zhttp://cds.cern.ch/record/2136060engLicari, James JEnlow, Leonard RHybrid microcircuit technology handbook: materials, processes, design, testing and productionEngineeringThe Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines willNoyes Publicationsoai:cds.cern.ch:21360601998 |
| spellingShingle | Engineering Licari, James J Enlow, Leonard R Hybrid microcircuit technology handbook: materials, processes, design, testing and production |
| title | Hybrid microcircuit technology handbook: materials, processes, design, testing and production |
| title_full | Hybrid microcircuit technology handbook: materials, processes, design, testing and production |
| title_fullStr | Hybrid microcircuit technology handbook: materials, processes, design, testing and production |
| title_full_unstemmed | Hybrid microcircuit technology handbook: materials, processes, design, testing and production |
| title_short | Hybrid microcircuit technology handbook: materials, processes, design, testing and production |
| title_sort | hybrid microcircuit technology handbook: materials, processes, design, testing and production |
| topic | Engineering |
| url | http://cds.cern.ch/record/2136060 |
| work_keys_str_mv | AT licarijamesj hybridmicrocircuittechnologyhandbookmaterialsprocessesdesigntestingandproduction AT enlowleonardr hybridmicrocircuittechnologyhandbookmaterialsprocessesdesigntestingandproduction |