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Test Beam Data Analysis for a Timepix3 Readout Chip
The vertex and tracker detector R&D for a future linear collider (CLICdp) aims at developing new silicon sensor technologies. The EP-LCD group has been helping develop a novel pixel detector chip called the Timepix3 with a very thick active silicon layer (675 μm). This thick detector can be used...
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| Lenguaje: | eng |
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2016
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| Acceso en línea: | http://cds.cern.ch/record/2212780 |