Silicon pixel R&D for CLIC

Challenging detector requirements are imposed by the physics goals at the future multi-TeV e+e- Compact Linear Collider (CLIC). A single point resolution of 3μm for the vertex detector and 7μm for the tracker is required. Moreover, the CLIC vertex detector and tracker need to be extremely light weighted with a material budget of 0.2 % X0 per layer in the ver- tex detector and 1-2%X0 in the tracker. A fast time slicing of 10ns is further required to suppress background from beam-beam interactions. A wide range of sensor and readout ASIC technologies are investigated within the CLIC silicon pixel R&D effort. Various hybrid planar sensor assemblies with a pixel size of 25x25μm2 and 55x55μm2 have been produced and characterised by laboratory measurements and during test-beam campaigns. Experimental and simulation results for thin (50μm-500μm) slim edge and active-edge planar, and High-Voltage CMOS sensors hybridised to various readout ASICs (Timepix, Timepix3, CLICpix) are presented.