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Annual Symposium in Electronics Packaging
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and Unl...
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| Lenguaje: | eng |
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Springer
1991
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| Acceso en línea: | https://dx.doi.org/10.1007/978-94-009-0439-2 http://cds.cern.ch/record/2224242 |