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Practical guide to the packaging of electronics: thermal and mechanical design and analysis
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Lenguaje: | eng |
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CRC Press
2016
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Acceso en línea: | http://cds.cern.ch/record/2241760 |
_version_ | 1780953238119383040 |
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author | Jamnia, Ali |
author_facet | Jamnia, Ali |
author_sort | Jamnia, Ali |
collection | CERN |
id | cern-2241760 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2016 |
publisher | CRC Press |
record_format | invenio |
spelling | cern-22417602021-04-21T19:21:58Zhttp://cds.cern.ch/record/2241760engJamnia, AliPractical guide to the packaging of electronics: thermal and mechanical design and analysisEngineeringCRC Pressoai:cds.cern.ch:22417602016 |
spellingShingle | Engineering Jamnia, Ali Practical guide to the packaging of electronics: thermal and mechanical design and analysis |
title | Practical guide to the packaging of electronics: thermal and mechanical design and analysis |
title_full | Practical guide to the packaging of electronics: thermal and mechanical design and analysis |
title_fullStr | Practical guide to the packaging of electronics: thermal and mechanical design and analysis |
title_full_unstemmed | Practical guide to the packaging of electronics: thermal and mechanical design and analysis |
title_short | Practical guide to the packaging of electronics: thermal and mechanical design and analysis |
title_sort | practical guide to the packaging of electronics: thermal and mechanical design and analysis |
topic | Engineering |
url | http://cds.cern.ch/record/2241760 |
work_keys_str_mv | AT jamniaali practicalguidetothepackagingofelectronicsthermalandmechanicaldesignandanalysis |