Cargando…
More-than-Moore 2.5D and 3D SiP integration
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business a...
| Autor principal: | |
|---|---|
| Lenguaje: | eng |
| Publicado: |
Springer
2017
|
| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1007/978-3-319-52548-8 http://cds.cern.ch/record/2253871 |