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RF and microwave microelectronics packaging II
Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
Springer
2017
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| Acceso en línea: | https://dx.doi.org/10.1007/978-3-319-51697-4 http://cds.cern.ch/record/2258600 |