Cargando…
Testing of interposer-based 2.5D integrated circuits
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,...
| Autores principales: | , |
|---|---|
| Lenguaje: | eng |
| Publicado: |
Springer
2017
|
| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1007/978-3-319-54714-5 http://cds.cern.ch/record/2258619 |