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The Phase-II ATLAS ITk Pixel Upgrade
The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase~2 shutdown (foreseen to take place around 2025) by an all-silicon detector called the ``ITk'' (Inner Tracker). The innermost portion of ITk will consist of a pixel detector with five layers in the barr...
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Lenguaje: | eng |
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2017
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Acceso en línea: | https://dx.doi.org/10.1088/1748-0221/12/07/C07023 http://cds.cern.ch/record/2262953 |
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author | Terzo, Stefano |
author_facet | Terzo, Stefano |
author_sort | Terzo, Stefano |
collection | CERN |
description | The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase~2 shutdown (foreseen to take place around 2025) by an all-silicon detector called the ``ITk'' (Inner Tracker). The innermost portion of ITk will consist of a pixel detector with five layers in the barrel region and ring-shaped supports in the end-cap regions. It will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation levels. The new pixel system could include up to 14 $\mathrm{m^2}$ of silicon, depending on the final layout, which is expected to be decided in 2017. Several layout options are being investigated at the moment, including some with novel inclined support structures in the barrel end-cap overlap region and others with very long innermost barrel layers. Forward coverage could be as high as |eta| $<4$. Supporting structures will be based on low mass, highly stable and highly thermally conductive carbon-based materials cooled by evaporative carbon dioxide circulated in thin-walled titanium pipes embedded in the structures. Planar, 3D, and CMOS sensors are being investigated to identify the optimal technology, which may be different for the various layers. The RD53 Collaboration is developing the new readout chip. The pixel off-detector readout electronics will be implemented in the framework of the general ATLAS trigger and DAQ system. A readout speed of up to 5 Gb/s per data link will be needed in the innermost layers going down to 640 Mb/s for the outermost. Because of the very high radiation level inside the detector, the first part of the transmission has to be implemented electrically, with signals converted for optical transmission at larger radii. Extensive tests are being carried out to prove the feasibility of implementing serial powering, which has been chosen as the baseline for the ITk pixel system due to the reduced material in the servicing cables foreseen for this option. |
id | cern-2262953 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2017 |
record_format | invenio |
spelling | cern-22629532019-09-30T06:29:59Zdoi:10.1088/1748-0221/12/07/C07023http://cds.cern.ch/record/2262953engTerzo, StefanoThe Phase-II ATLAS ITk Pixel UpgradeParticle Physics - ExperimentThe entire tracking system of the ATLAS experiment will be replaced during the LHC Phase~2 shutdown (foreseen to take place around 2025) by an all-silicon detector called the ``ITk'' (Inner Tracker). The innermost portion of ITk will consist of a pixel detector with five layers in the barrel region and ring-shaped supports in the end-cap regions. It will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation levels. The new pixel system could include up to 14 $\mathrm{m^2}$ of silicon, depending on the final layout, which is expected to be decided in 2017. Several layout options are being investigated at the moment, including some with novel inclined support structures in the barrel end-cap overlap region and others with very long innermost barrel layers. Forward coverage could be as high as |eta| $<4$. Supporting structures will be based on low mass, highly stable and highly thermally conductive carbon-based materials cooled by evaporative carbon dioxide circulated in thin-walled titanium pipes embedded in the structures. Planar, 3D, and CMOS sensors are being investigated to identify the optimal technology, which may be different for the various layers. The RD53 Collaboration is developing the new readout chip. The pixel off-detector readout electronics will be implemented in the framework of the general ATLAS trigger and DAQ system. A readout speed of up to 5 Gb/s per data link will be needed in the innermost layers going down to 640 Mb/s for the outermost. Because of the very high radiation level inside the detector, the first part of the transmission has to be implemented electrically, with signals converted for optical transmission at larger radii. Extensive tests are being carried out to prove the feasibility of implementing serial powering, which has been chosen as the baseline for the ITk pixel system due to the reduced material in the servicing cables foreseen for this option.ATL-ITK-PROC-2017-002oai:cds.cern.ch:22629532017-05-09 |
spellingShingle | Particle Physics - Experiment Terzo, Stefano The Phase-II ATLAS ITk Pixel Upgrade |
title | The Phase-II ATLAS ITk Pixel Upgrade |
title_full | The Phase-II ATLAS ITk Pixel Upgrade |
title_fullStr | The Phase-II ATLAS ITk Pixel Upgrade |
title_full_unstemmed | The Phase-II ATLAS ITk Pixel Upgrade |
title_short | The Phase-II ATLAS ITk Pixel Upgrade |
title_sort | phase-ii atlas itk pixel upgrade |
topic | Particle Physics - Experiment |
url | https://dx.doi.org/10.1088/1748-0221/12/07/C07023 http://cds.cern.ch/record/2262953 |
work_keys_str_mv | AT terzostefano thephaseiiatlasitkpixelupgrade AT terzostefano phaseiiatlasitkpixelupgrade |