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Testbeam Studies on Pick-Up in Sensors with Embedded Pitch Adapters
For silicon strip sensors, the tracking information specifications can lead to challenging requirements for wire bonding. A common strategy is to use external pitch adapters to facilitate this step in the production of detector modules. A novel approach previously discussed in [1], is to implement t...
| Autores principales: | , , , , , , , , , , , , , |
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| Lenguaje: | eng |
| Publicado: |
2017
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2296606 |