First study of small-cell 3D Silicon Pixel Detectors for the High Luminosity LHC

A study of 3D pixel sensors of cell size 50 {\mu}m x 50 {\mu}m fabricated at IMB-CNM using double-sided n-on-p 3D technology is presented. Sensors were bump-bonded to the ROC4SENS readout chip. For the first time in such a small-pitch hybrid assembly, the sensor response to ionizing radiation in a t...

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Detalles Bibliográficos
Autores principales: Currás, E., Duarte-Campderrós, J., Fernández, M., García, A., Gómez, G., González, J., Jaramillo, R., Moya, D., Vila, I., Hidalgo, S., Manna, M., Pellegrini, G., Quirion, D., Pitzl, D., Ebrahimi, A., Rohe, T., Wiederkehr, S.
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: NIM A 2018
Materias:
Detectors and Experimental Techniques
7: Advanced hybrid pixel detectors
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2019.04.037
http://cds.cern.ch/record/2622152

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