Cargando…
Encapsulation technologies for electronic applications
| Autores principales: | , , , |
|---|---|
| Lenguaje: | eng |
| Publicado: |
William Andrew
2018
|
| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2648338 |
| _version_ | 1780960672371179520 |
|---|---|
| author | Zhang, Jiawei Ardebili, Haleh Pecht, Michael Licari, James J |
| author_facet | Zhang, Jiawei Ardebili, Haleh Pecht, Michael Licari, James J |
| author_sort | Zhang, Jiawei |
| collection | CERN |
| id | cern-2648338 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2018 |
| publisher | William Andrew |
| record_format | invenio |
| spelling | cern-26483382021-04-21T18:39:28Zhttp://cds.cern.ch/record/2648338engZhang, JiaweiArdebili, HalehPecht, MichaelLicari, James JEncapsulation technologies for electronic applicationsEngineeringWilliam Andrewoai:cds.cern.ch:26483382018 |
| spellingShingle | Engineering Zhang, Jiawei Ardebili, Haleh Pecht, Michael Licari, James J Encapsulation technologies for electronic applications |
| title | Encapsulation technologies for electronic applications |
| title_full | Encapsulation technologies for electronic applications |
| title_fullStr | Encapsulation technologies for electronic applications |
| title_full_unstemmed | Encapsulation technologies for electronic applications |
| title_short | Encapsulation technologies for electronic applications |
| title_sort | encapsulation technologies for electronic applications |
| topic | Engineering |
| url | http://cds.cern.ch/record/2648338 |
| work_keys_str_mv | AT zhangjiawei encapsulationtechnologiesforelectronicapplications AT ardebilihaleh encapsulationtechnologiesforelectronicapplications AT pechtmichael encapsulationtechnologiesforelectronicapplications AT licarijamesj encapsulationtechnologiesforelectronicapplications |