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Encapsulation technologies for electronic applications

Detalles Bibliográficos
Autores principales:	Zhang, Jiawei, Ardebili, Haleh, Pecht, Michael, Licari, James J
Lenguaje:	eng
Publicado:	William Andrew 2018
Materias:	Engineering
Acceso en línea:	http://cds.cern.ch/record/2648338

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