Time and Energy Calibration of Timepix3 Assemblies with Thin Silicon Sensors

The Timepix3 ASIC is a multi-purpose readout chip for hybrid pixel detectors. It can measure time and energy simultaneously by employing time-of-arrival (ToA) and time-over-threshold (ToT) techniques. In the presented work, a time efficient method for pixel-by-pixel calibration of both ToA and ToT is investigated. Five assemblies of Timepix3 ASICs bump bonded to silicon pixel sensors of different thicknesses between 50 μm and 150 μm are calibrated with electrical test pulses, x-ray fluorescence and beams of minimum ionising particles in a reference telescope. After calibration, the energy resolution at 6.40 keV is 9.3 %. For 120 GeV/c pions, time resolutions down to 0.72 ns are achieved.