Performance evaluation of thin active-edge planar sensors for the CLIC vertex detector

Thin planar silicon sensors with a pitch of 55 μm, active edge and various guard ring layouts are investigated, using two-dimensional finite-element TCAD simulations. The simulation results have been compared to experimental data, and an overall good agreement is observed. It is demonstrated that 50 μm thin planar silicon sensors with active edge with floating guard ring or without guard ring can be operated fully efficiently up to the physical edge of the sensor. The simulation findings are used to identify suitable sensor designs for application in the high-precision vertex detector of the future CLIC linear $e^+ e^−$ collider.