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First Results on 3D Pixel Sensors Interconnected to the RD53A Readout Chip after Irradiation to $1\times$$10^{16}$neq cm$^{-2}$
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about $1\times$$10^{16}$\,neq cm$^{-2}$ (1\,MeV equivalent neutrons). All presen...
Autores principales: | , , , , , , , , , , , , , , , , , , , , |
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Formato: | info:eu-repo/semantics/article |
Lenguaje: | eng |
Publicado: |
JINST
2019
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Materias: | |
Acceso en línea: | https://dx.doi.org/10.1088/1748-0221/14/06/C06018 http://cds.cern.ch/record/2681818 |
Sumario: | Results obtained with 3D columnar
pixel sensors bump-bonded to the RD53A prototype
readout chip are reported.
The interconnected modules have been tested in a hadron beam
before and after irradiation
to a fluence of about $1\times$$10^{16}$\,neq cm$^{-2}$ (1\,MeV equivalent neutrons).
All presented results are part of the CMS R\&D
activities in view of the pixel detector upgrade for the
High Luminosity phase of the LHC at CERN (HL-LHC).
A preliminary analysis of the collected data shows hit detection
efficiencies around 97\% measured after proton irradiation. |
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