First Results on 3D Pixel Sensors Interconnected to the RD53A Readout Chip after Irradiation to $1\times$$10^{16}$neq cm$^{-2}$

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about $1\times$$10^{16}$\,neq cm$^{-2}$ (1\,MeV equivalent neutrons). All presen...

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Detalles Bibliográficos
Autores principales: Meschini, M., Ceccarelli, R., Dinardo, M., Gennai, S., Moroni, L., Zuolo, D., Demaria, L., Monteil, E., Gaioni, L., Messineo, A., Currás, E., Duarte, J., Fernández, M., Gómez, G., Garía, A., González, J., Silva, E., Vila, I., Dalla Betta, G.F., Mendicino, R., Boscardin, M.
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: JINST 2019
Materias:
Detectors and Experimental Techniques
7: Advanced hybrid pixel detectors
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/14/06/C06018
http://cds.cern.ch/record/2681818

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