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2.5D printing: bridging the gap between 2D and 3D applications
Autores principales: | , |
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Lenguaje: | eng |
Publicado: |
John Wiley & Sons
2018
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Materias: | |
Acceso en línea: | http://cds.cern.ch/record/2691779 |
_version_ | 1780963900638887936 |
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author | Parraman, Carinna Ortiz Segovia, Maria V |
author_facet | Parraman, Carinna Ortiz Segovia, Maria V |
author_sort | Parraman, Carinna |
collection | CERN |
id | cern-2691779 |
institution | Organización Europea para la Investigación Nuclear |
language | eng |
publishDate | 2018 |
publisher | John Wiley & Sons |
record_format | invenio |
spelling | cern-26917792021-04-21T18:19:02Zhttp://cds.cern.ch/record/2691779engParraman, CarinnaOrtiz Segovia, Maria V2.5D printing: bridging the gap between 2D and 3D applicationsEngineeringJohn Wiley & Sonsoai:cds.cern.ch:26917792018 |
spellingShingle | Engineering Parraman, Carinna Ortiz Segovia, Maria V 2.5D printing: bridging the gap between 2D and 3D applications |
title | 2.5D printing: bridging the gap between 2D and 3D applications |
title_full | 2.5D printing: bridging the gap between 2D and 3D applications |
title_fullStr | 2.5D printing: bridging the gap between 2D and 3D applications |
title_full_unstemmed | 2.5D printing: bridging the gap between 2D and 3D applications |
title_short | 2.5D printing: bridging the gap between 2D and 3D applications |
title_sort | 2.5d printing: bridging the gap between 2d and 3d applications |
topic | Engineering |
url | http://cds.cern.ch/record/2691779 |
work_keys_str_mv | AT parramancarinna 25dprintingbridgingthegapbetween2dand3dapplications AT ortizsegoviamariav 25dprintingbridgingthegapbetween2dand3dapplications |