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2.5D printing: bridging the gap between 2D and 3D applications

Detalles Bibliográficos
Autores principales: Parraman, Carinna, Ortiz Segovia, Maria V
Lenguaje:eng
Publicado: John Wiley & Sons 2018
Materias:
Acceso en línea:http://cds.cern.ch/record/2691779
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author Parraman, Carinna
Ortiz Segovia, Maria V
author_facet Parraman, Carinna
Ortiz Segovia, Maria V
author_sort Parraman, Carinna
collection CERN
id cern-2691779
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2018
publisher John Wiley & Sons
record_format invenio
spelling cern-26917792021-04-21T18:19:02Zhttp://cds.cern.ch/record/2691779engParraman, CarinnaOrtiz Segovia, Maria V2.5D printing: bridging the gap between 2D and 3D applicationsEngineeringJohn Wiley & Sonsoai:cds.cern.ch:26917792018
spellingShingle Engineering
Parraman, Carinna
Ortiz Segovia, Maria V
2.5D printing: bridging the gap between 2D and 3D applications
title 2.5D printing: bridging the gap between 2D and 3D applications
title_full 2.5D printing: bridging the gap between 2D and 3D applications
title_fullStr 2.5D printing: bridging the gap between 2D and 3D applications
title_full_unstemmed 2.5D printing: bridging the gap between 2D and 3D applications
title_short 2.5D printing: bridging the gap between 2D and 3D applications
title_sort 2.5d printing: bridging the gap between 2d and 3d applications
topic Engineering
url http://cds.cern.ch/record/2691779
work_keys_str_mv AT parramancarinna 25dprintingbridgingthegapbetween2dand3dapplications
AT ortizsegoviamariav 25dprintingbridgingthegapbetween2dand3dapplications