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Electrical resistance of the solder connections for the consolidation of the LHC main interconnection splices

For the consolidation of the LHC main interconnection splices it is planned to solder shunts onto each of the 10,170 splices. The solder that has been selected for this purpose is Sn60Pb40. In this context the electrical resistance of the shunt to busbar lap splices has been measured in the temperat...

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Detalles Bibliográficos
Autor principal:	Lutum, Robin
Lenguaje:	eng
Publicado:	2019
Materias:	Accelerators and Storage Rings Engineering
Acceso en línea:	http://cds.cern.ch/record/2693633

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