Optimization of the front-end read-out electronics for the Belle II DEPFET Sensor

The Belle experiment at the KEKB e$^{+}$e$^{−}$-collider in Tsukuba, Japan yielded an integrated luminosity of 1 ab$^{−1}$. The collected data was used for in depth $B$-physics studies, as well as beyond standard model searches. For even more detailed physics studies and higher sensitivity to new physics contributions, the KEKB collider is being upgraded to SuperKEKB, which is expected to deliver a 40 times higher instantaneous luminosity. Also the Belle detector will be upgraded to Belle II. Besides the upgrade of the Belle-proven sub-detector components, Belle II will be equipped with additional two layers of a silicon pixel detector closest to the interaction point, which will improve vertex resolution. This pixel detector will be based on the DEPFET technology, which allows for very thin sensors to reduce energy loss and multiple scattering effects. For the read-out of the DEPFET pixel matrices, three dedicated front-end chips are being developed. Confirming and studying the functionality of the chip designs is crucial. In this thesis, testing algorithms will be presented and discussed, that were developed for investigating and optimizing the performance of the current designs of the front-end read-out electronics. The software is used to evaluate parameter scans, tune the chip parameters and investigate weaknesses of the existing chip designs, in order to provide feed-back to the chip designers for future design iterations.