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Test results of ATLASPIX3 — A reticle size HVCMOS pixel sensor designed for construction of multi chip modules

High voltage CMOS pixel sensors will be or are proposed to be used in several particle physics experiments for particle tracking like Mu3e experiment. ATLASPIX3 is the first full reticle size monolithic HVCMOS sensor for construction of multi-chip modules. The specifications for the use case have be...

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Autores principales: Schimassek, R., Andreazza, A., Augustin, H., Barbero, M., Benoit, M., Ehrler, F., Iacobucci, G., Meneses, A., Pangaud, P., Prathapan, M., Schöning, A., Vilella, E., Weber, A., Weber, M., Wong, W., Zhang, H., Perić, I.
Publicado: 2021
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2020.164812
http://cds.cern.ch/record/2744155
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author Schimassek, R.
Andreazza, A.
Augustin, H.
Barbero, M.
Benoit, M.
Ehrler, F.
Iacobucci, G.
Meneses, A.
Pangaud, P.
Prathapan, M.
Schöning, A.
Vilella, E.
Weber, A.
Weber, M.
Wong, W.
Zhang, H.
Perić, I.
author_facet Schimassek, R.
Andreazza, A.
Augustin, H.
Barbero, M.
Benoit, M.
Ehrler, F.
Iacobucci, G.
Meneses, A.
Pangaud, P.
Prathapan, M.
Schöning, A.
Vilella, E.
Weber, A.
Weber, M.
Wong, W.
Zhang, H.
Perić, I.
author_sort Schimassek, R.
collection CERN
description High voltage CMOS pixel sensors will be or are proposed to be used in several particle physics experiments for particle tracking like Mu3e experiment. ATLASPIX3 is the first full reticle size monolithic HVCMOS sensor for construction of multi-chip modules. The specifications for the use case have been taken from ATLAS pixel upgrade in fifth layer where it was a candidate for. The size of the chip is $2.0×2.1\mathrm{cm}^2$ with periphery at one side which makes the chip 3-side buttable. ATLASPIX3 has been implemented in a standard 180 nm HVCMOS process. Each pixel has an area of $150×50μ\mathrm{m}^2$ and contains a large charge collecting electrode implemented as deep n-well. The depleted volume around the n-well is enlarged by a high voltage bias and the usage of higher resistivity substrate. The readout electronics supports both triggered and triggerless readout with zero-suppression. ATLASPIX3 could be used for the construction of CMOS modules for particle tracking in experiments where high time resolution, high radiation tolerance, low power and low material budget are required. In the design phase, special attention has been paid to decreasing timing differences between pixels and the rate capability of the readout.
id cern-2744155
institution Organización Europea para la Investigación Nuclear
publishDate 2021
record_format invenio
spelling cern-27441552020-11-11T19:33:08Zdoi:10.1016/j.nima.2020.164812http://cds.cern.ch/record/2744155Schimassek, R.Andreazza, A.Augustin, H.Barbero, M.Benoit, M.Ehrler, F.Iacobucci, G.Meneses, A.Pangaud, P.Prathapan, M.Schöning, A.Vilella, E.Weber, A.Weber, M.Wong, W.Zhang, H.Perić, I.Test results of ATLASPIX3 — A reticle size HVCMOS pixel sensor designed for construction of multi chip modulesHigh voltage CMOS pixel sensors will be or are proposed to be used in several particle physics experiments for particle tracking like Mu3e experiment. ATLASPIX3 is the first full reticle size monolithic HVCMOS sensor for construction of multi-chip modules. The specifications for the use case have been taken from ATLAS pixel upgrade in fifth layer where it was a candidate for. The size of the chip is $2.0×2.1\mathrm{cm}^2$ with periphery at one side which makes the chip 3-side buttable. ATLASPIX3 has been implemented in a standard 180 nm HVCMOS process. Each pixel has an area of $150×50μ\mathrm{m}^2$ and contains a large charge collecting electrode implemented as deep n-well. The depleted volume around the n-well is enlarged by a high voltage bias and the usage of higher resistivity substrate. The readout electronics supports both triggered and triggerless readout with zero-suppression. ATLASPIX3 could be used for the construction of CMOS modules for particle tracking in experiments where high time resolution, high radiation tolerance, low power and low material budget are required. In the design phase, special attention has been paid to decreasing timing differences between pixels and the rate capability of the readout.oai:cds.cern.ch:27441552021
spellingShingle Schimassek, R.
Andreazza, A.
Augustin, H.
Barbero, M.
Benoit, M.
Ehrler, F.
Iacobucci, G.
Meneses, A.
Pangaud, P.
Prathapan, M.
Schöning, A.
Vilella, E.
Weber, A.
Weber, M.
Wong, W.
Zhang, H.
Perić, I.
Test results of ATLASPIX3 — A reticle size HVCMOS pixel sensor designed for construction of multi chip modules
title Test results of ATLASPIX3 — A reticle size HVCMOS pixel sensor designed for construction of multi chip modules
title_full Test results of ATLASPIX3 — A reticle size HVCMOS pixel sensor designed for construction of multi chip modules
title_fullStr Test results of ATLASPIX3 — A reticle size HVCMOS pixel sensor designed for construction of multi chip modules
title_full_unstemmed Test results of ATLASPIX3 — A reticle size HVCMOS pixel sensor designed for construction of multi chip modules
title_short Test results of ATLASPIX3 — A reticle size HVCMOS pixel sensor designed for construction of multi chip modules
title_sort test results of atlaspix3 — a reticle size hvcmos pixel sensor designed for construction of multi chip modules
url https://dx.doi.org/10.1016/j.nima.2020.164812
http://cds.cern.ch/record/2744155
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