Temporal characterisation of silicon sensors on Timepix3 ASICs

The timing performance of silicon sensors bump-bonded to Timepix3 ASICs is investigated, prior to and after different types of irradiation up to 8 × 1015 1 MeV  neq cm−2. The sensors have been tested with a beam of charged particles in two different configurations, perpendicular to and almost parall...

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Detalles Bibliográficos
Autores principales: Dall'Occo, E., Akiba, K., van Beuzekom, M., Buchanan, E., Collins, P., Evans, T., Lima, V. Franco, Geertsema, R., Schindler, H., Snoek, H., Tsopelas, P.
Lenguaje:eng
Publicado: 2021
Materias:
hep-ex
Particle Physics - Experiment
physics.ins-det
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/16/07/P07035
http://cds.cern.ch/record/2753970

Internet

https://dx.doi.org/10.1088/1748-0221/16/07/P07035
http://cds.cern.ch/record/2753970

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