Cargando…
Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: fundamental mechanisms and application to IC interconnect technology
| Autores principales: | , , |
|---|---|
| Lenguaje: | eng |
| Publicado: |
Springer
2002
|
| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2757502 |
| _version_ | 1780969950926602240 |
|---|---|
| author | Borst, Christopher Lyle Gill, William N Gutmann, Ronald J |
| author_facet | Borst, Christopher Lyle Gill, William N Gutmann, Ronald J |
| author_sort | Borst, Christopher Lyle |
| collection | CERN |
| id | cern-2757502 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2002 |
| publisher | Springer |
| record_format | invenio |
| spelling | cern-27575022021-04-21T16:41:13Zhttp://cds.cern.ch/record/2757502engBorst, Christopher LyleGill, William NGutmann, Ronald JChemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: fundamental mechanisms and application to IC interconnect technologyXXSpringeroai:cds.cern.ch:27575022002 |
| spellingShingle | XX Borst, Christopher Lyle Gill, William N Gutmann, Ronald J Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: fundamental mechanisms and application to IC interconnect technology |
| title | Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: fundamental mechanisms and application to IC interconnect technology |
| title_full | Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: fundamental mechanisms and application to IC interconnect technology |
| title_fullStr | Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: fundamental mechanisms and application to IC interconnect technology |
| title_full_unstemmed | Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: fundamental mechanisms and application to IC interconnect technology |
| title_short | Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: fundamental mechanisms and application to IC interconnect technology |
| title_sort | chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: fundamental mechanisms and application to ic interconnect technology |
| topic | XX |
| url | http://cds.cern.ch/record/2757502 |
| work_keys_str_mv | AT borstchristopherlyle chemicalmechanicalpolishingoflowdielectricconstantpolymersandorganosilicateglassesfundamentalmechanismsandapplicationtoicinterconnecttechnology AT gillwilliamn chemicalmechanicalpolishingoflowdielectricconstantpolymersandorganosilicateglassesfundamentalmechanismsandapplicationtoicinterconnecttechnology AT gutmannronaldj chemicalmechanicalpolishingoflowdielectricconstantpolymersandorganosilicateglassesfundamentalmechanismsandapplicationtoicinterconnecttechnology |