Cargando…

Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: fundamental mechanisms and application to IC interconnect technology

Detalles Bibliográficos
Autores principales:	Borst, Christopher Lyle, Gill, William N, Gutmann, Ronald J
Lenguaje:	eng
Publicado:	Springer 2002
Materias:	XX
Acceso en línea:	http://cds.cern.ch/record/2757502

Ejemplares similares

Extraction of Perchlorate Using Porous Organosilicate Materials
por: Johnson, Brandy J., et al.
Publicado: (2013)

Relationships between chemical structure, mechanical properties and materials processing in nanopatterned organosilicate fins
por: Stan, Gheorghe, et al.
Publicado: (2017)

Chiral Control in Pentacoordinate Systems: The Case of Organosilicates
por: van der Boon, Leon J. P., et al.
Publicado: (2018)

Effects of Methyl Terminal and Carbon Bridging Groups Ratio on Critical Properties of Porous Organosilicate Glass Films
por: Vishnevskiy, Alexey S., et al.
Publicado: (2020)

Effect of methyl terminal and ethylene bridging groups on porous organosilicate glass films: FTIR, ellipsometric porosimetry, luminescence dataset
por: Rasadujjaman, Md, et al.
Publicado: (2021)

Analytical Study of Porous Organosilicate Glass Films Prepared from Mixtures of 1,3,5- and 1,3-Alkoxysilylbenzenes
por: Rasadujjaman, Md, et al.
Publicado: (2021)

Cold-Setting Inkjet Printed Titania Patterns Reinforced by Organosilicate Binder
por: Králová, Marcela, et al.
Publicado: (2015)

Composition of Organosilicate Coatings High-Temperature Breakdown Products and Their Distribution in the Weld
por: Zhabrev, Leonid, et al.
Publicado: (2022)

Are the fundamental constants constant?
Publicado: (2003)

Are the fundamental constants constant?
por: Fritzsch, Harald
Publicado: (2003)

Heat-Resistant Ferroelectric-Polymer Nanocomposite with High Dielectric Constant
por: Mukhin, Nikolay, et al.
Publicado: (2018)

Change in Electrical/Mechanical Properties of Plasma Polymerized Low Dielectric Constant Films after Etching in CF(4)/O(2) Plasma for Semiconductor Multilevel Interconnects
por: Baek, Namwuk, et al.
Publicado: (2023)

Time Dependent Dielectric Breakdown in Copper Low-k Interconnects: Mechanisms and Reliability Models
por: Wong, Terence K.S.
Publicado: (2012)

Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
por: Zhao, Jin, et al.
Publicado: (2022)

On Dielectric Constant and Enzymatic Kinetics : III. Interrelationships of dielectric constant and pH
por: Castañeda-Agulló, M., et al.
Publicado: (1960)

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions
por: Arıbuğa, Dilara, et al.
Publicado: (2022)

Process and Microstructure to Achieve Ultra-high Dielectric Constant in Ceramic-Polymer Composites
por: Zhang, Lin, et al.
Publicado: (2016)

Relationship between Atomic Structure, Composition, and Dielectric Constant in Zr–SiO(2) Glasses
por: Sheikholeslam, S. Arash, et al.
Publicado: (2021)

Fundamentals of piezoelectric sensorics: mechanical, dielectric, and thermodynamical properties of piezoelectric materials
por: Tichý, Jan, et al.
Publicado: (2010)

Conference on Fundamental Symmetries and Fundamental Constants
por: Collective
Publicado: (2004)

Variations in Proteins Dielectric Constants
por: Amin, Muhamed, et al.
Publicado: (2020)

The fundamental constants of physics /
por: Cohen, E. Richard, 1922-
Publicado: (1957)

The fundamental atomic constants
por: Sanders, John Howard
Publicado: (1961)

The fundamental constants of physics
por: Cohen, E Richard, et al.
Publicado: (1957)

Dispersion and Polishing Mechanism of a Novel CeO(2)-LaOF-Based Chemical Mechanical Polishing Slurry for Quartz Glass
por: Zhao, Zifeng, et al.
Publicado: (2023)

Development of Polymer Blends Based on PVA:POZ with Low Dielectric Constant for Microelectronic Applications
por: Aziz, Shujahadeen B., et al.
Publicado: (2019)

Determining the dielectric constant of injection-molded polymer-matrix nanocomposites filled with barium titanate
por: Brito, Daniel, et al.
Publicado: (2020)

The mechanics of solder alloy interconnects
por: Frear, D R, et al.
Publicado: (1994)

On the Time Dependence of Fundamental Constants
por: Gregori, A
Publicado: (2002)

Astrophysics, Clocks and Fundamental Constants
por: Karshenboim, Savely G, et al.
Publicado: (2004)

The fundamental constants and quantum electrodynamics
por: Taylor, Barry N, et al.
Publicado: (1969)

Fundamental physical constants and their stability
por: Melnikov, V N
Publicado: (1993)

Fundamental Constants at High Energy
por: Fritzsch, Harald
Publicado: (2002)

Trialogue on the number of fundamental constants
por: Duff, M.J., et al.
Publicado: (2001)

Polymer Nanocomposites with High Energy Density Utilizing Oriented Nanosheets and High-Dielectric-Constant Nanoparticles
por: Li, Yushu, et al.
Publicado: (2021)

Feasibility of Predicting Static Dielectric Constants of Polymer Materials: A Density Functional Theory Method
por: Tang, Zheng, et al.
Publicado: (2021)

The Interconnection of Carbon Active Addition on Mechanical Properties of Hybrid Agel/Glass Fiber-Reinforced Green Composite
por: Nuryanta, Muhammad Irfan, et al.
Publicado: (2023)

New Atomistic Insights on the Chemical Mechanical Polishing of Silica Glass with Ceria Nanoparticles
por: Brugnoli, Luca, et al.
Publicado: (2023)

Preparation and Characterization of CCTO/PDMS Dielectric Elastomers with High Dielectric Constant and Low Dielectric Loss
por: Wang, Wenqi, et al.
Publicado: (2021)

Materials Fundamentals of Gate Dielectrics
por: Demkov, Alexander A, et al.
Publicado: (2006)

Cannot write session to /tmp/vufind_sessions/sess_qdgshkcam2cfr3hgpv15dcu2q8