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Characterization of Integrated Circuit Packaging Materials
| Autor principal: | |
|---|---|
| Lenguaje: | eng |
| Publicado: |
Newnes
2013
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2758437 |
| _version_ | 1780970139051622400 |
|---|---|
| author | Moore, Thomas |
| author_facet | Moore, Thomas |
| author_sort | Moore, Thomas |
| collection | CERN |
| id | cern-2758437 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2013 |
| publisher | Newnes |
| record_format | invenio |
| spelling | cern-27584372021-04-21T16:40:31Zhttp://cds.cern.ch/record/2758437engMoore, ThomasCharacterization of Integrated Circuit Packaging MaterialsXXNewnesoai:cds.cern.ch:27584372013 |
| spellingShingle | XX Moore, Thomas Characterization of Integrated Circuit Packaging Materials |
| title | Characterization of Integrated Circuit Packaging Materials |
| title_full | Characterization of Integrated Circuit Packaging Materials |
| title_fullStr | Characterization of Integrated Circuit Packaging Materials |
| title_full_unstemmed | Characterization of Integrated Circuit Packaging Materials |
| title_short | Characterization of Integrated Circuit Packaging Materials |
| title_sort | characterization of integrated circuit packaging materials |
| topic | XX |
| url | http://cds.cern.ch/record/2758437 |
| work_keys_str_mv | AT moorethomas characterizationofintegratedcircuitpackagingmaterials |