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ALICE ITS3 – a next generation vertex detector based on bent, wafer-scale CMOS sensors

<!--HTML--><p>ALICE is carrying out the R&amp;D to replace during LS3 its innermost tracking layers by a new device (ITS3) that approaches the "golden detector". The aim is to reduce the material budget to a minimum to less than 0.05% X0, get closer to the interaction point...

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Autor principal: Mager, Magnus
Lenguaje:eng
Publicado: 2021
Materias:
Acceso en línea:http://cds.cern.ch/record/2782272
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author Mager, Magnus
author_facet Mager, Magnus
author_sort Mager, Magnus
collection CERN
description <!--HTML--><p>ALICE is carrying out the R&amp;D to replace during LS3 its innermost tracking layers by a new device (ITS3) that approaches the "golden detector". The aim is to reduce the material budget to a minimum to less than 0.05% X0, get closer to the interaction point with the first layer at a radial distance of 18 mm&nbsp;while the beam pipe has a radius of 16&nbsp;mm, and&nbsp;keep&nbsp;a high intrinsic spatial resolution&nbsp;of&nbsp;less than 5&nbsp;μm in both longitudinal and transverse directions.</p> <p>These figures of merit are obtained by exploiting the mechanical properties of thin &nbsp;(&lt;50&nbsp;μm) silicon chips which are flexible enough to be bent onto truly cylindrical surfaces of radii well below 18&nbsp;mm. This not only minimises the achievable distance from the beam pipe (no staggering needed), but also gives the structure an intrinsic stability, removing the need of considerable support structures. Using stitching, full half-layers are integrated into single silicon pieces (up to ~28⨉9&nbsp;cm² in size cut from a 300&nbsp;mm wafer), removing the need of printed circuit boards for interconnection in the active area. Finally, the low power consumption (&lt;40&nbsp;mW/cm²) that can be achieved with MAPS makes air cooling sufficient to operate the detector. All this together will allow to build the whole detector from only six large sensors and barely anything else within the active volume.</p> <p>In this seminar, the motivation of building such a device from a physics and detector performance point of view will be shortly reviewed, the conceived detector layout and specifications will be explained, and a number of obtained R&amp;D highlights will be illustrated. The latter will contain results of beams tests with bent CMOS sensors, mechanical prototypes of detector half-layers, as well as an overview of the CMOS sensor developments. I will conclude with an outlook of the remaining R&amp;D plans and a timeline towards the Technical Design Report as well as construction and installation.<br /> &nbsp;</p> ALICE ITS3 Seminar: https://cern.zoom.us/j/64947018843?pwd=OE94aW9NV2M3SWd5VkdPYll4ZU5NZz09
id cern-2782272
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2021
record_format invenio
spelling cern-27822722022-11-02T22:02:57Zhttp://cds.cern.ch/record/2782272engMager, MagnusALICE ITS3 – a next generation vertex detector based on bent, wafer-scale CMOS sensorsALICE ITS3 – a next generation vertex detector based on bent, wafer-scale CMOS sensorsDetector Seminar<!--HTML--><p>ALICE is carrying out the R&amp;D to replace during LS3 its innermost tracking layers by a new device (ITS3) that approaches the "golden detector". The aim is to reduce the material budget to a minimum to less than 0.05% X0, get closer to the interaction point with the first layer at a radial distance of 18 mm&nbsp;while the beam pipe has a radius of 16&nbsp;mm, and&nbsp;keep&nbsp;a high intrinsic spatial resolution&nbsp;of&nbsp;less than 5&nbsp;μm in both longitudinal and transverse directions.</p> <p>These figures of merit are obtained by exploiting the mechanical properties of thin &nbsp;(&lt;50&nbsp;μm) silicon chips which are flexible enough to be bent onto truly cylindrical surfaces of radii well below 18&nbsp;mm. This not only minimises the achievable distance from the beam pipe (no staggering needed), but also gives the structure an intrinsic stability, removing the need of considerable support structures. Using stitching, full half-layers are integrated into single silicon pieces (up to ~28⨉9&nbsp;cm² in size cut from a 300&nbsp;mm wafer), removing the need of printed circuit boards for interconnection in the active area. Finally, the low power consumption (&lt;40&nbsp;mW/cm²) that can be achieved with MAPS makes air cooling sufficient to operate the detector. All this together will allow to build the whole detector from only six large sensors and barely anything else within the active volume.</p> <p>In this seminar, the motivation of building such a device from a physics and detector performance point of view will be shortly reviewed, the conceived detector layout and specifications will be explained, and a number of obtained R&amp;D highlights will be illustrated. The latter will contain results of beams tests with bent CMOS sensors, mechanical prototypes of detector half-layers, as well as an overview of the CMOS sensor developments. I will conclude with an outlook of the remaining R&amp;D plans and a timeline towards the Technical Design Report as well as construction and installation.<br /> &nbsp;</p> ALICE ITS3 Seminar: https://cern.zoom.us/j/64947018843?pwd=OE94aW9NV2M3SWd5VkdPYll4ZU5NZz09oai:cds.cern.ch:27822722021
spellingShingle Detector Seminar
Mager, Magnus
ALICE ITS3 – a next generation vertex detector based on bent, wafer-scale CMOS sensors
title ALICE ITS3 – a next generation vertex detector based on bent, wafer-scale CMOS sensors
title_full ALICE ITS3 – a next generation vertex detector based on bent, wafer-scale CMOS sensors
title_fullStr ALICE ITS3 – a next generation vertex detector based on bent, wafer-scale CMOS sensors
title_full_unstemmed ALICE ITS3 – a next generation vertex detector based on bent, wafer-scale CMOS sensors
title_short ALICE ITS3 – a next generation vertex detector based on bent, wafer-scale CMOS sensors
title_sort alice its3 – a next generation vertex detector based on bent, wafer-scale cmos sensors
topic Detector Seminar
url http://cds.cern.ch/record/2782272
work_keys_str_mv AT magermagnus aliceits3anextgenerationvertexdetectorbasedonbentwaferscalecmossensors