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3D pixel modules characterization with RD53A readout for ATLAS ITk Upgrade

The High-Luminosity LHC (HL-LHC) with its large number of collisions per bunch crossing will present a very challenging environment to the particle detectors. To cope with these conditions, the current inner detector of the ATLAS experiment will be replaced with a new all-silicon Inner Tracker (ITk)...

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Detalles Bibliográficos
Autor principal: Vannoli, L
Lenguaje:eng
Publicado: 2021
Materias:
Acceso en línea:https://dx.doi.org/10.1393/ncc/i2021-21082-9
http://cds.cern.ch/record/2791317
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author Vannoli, L
author_facet Vannoli, L
author_sort Vannoli, L
collection CERN
description The High-Luminosity LHC (HL-LHC) with its large number of collisions per bunch crossing will present a very challenging environment to the particle detectors. To cope with these conditions, the current inner detector of the ATLAS experiment will be replaced with a new all-silicon Inner Tracker (ITk) during the Phase-II upgrade. Due to their superior radiation hardness, it has been chosen to instrument the ITk innermost layer with 3D pixel sensors. In this article the new pixel 3D sensor design and technology are reviewed, together with their characterisation before and after exposition to large radiation dose, close to the one expected for the innermost layer of ITk after 2000 fb −1 of integrated luminosity delivered by HL-LHC.
id cern-2791317
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2021
record_format invenio
spelling cern-27913172022-11-17T14:30:14Zdoi:10.1393/ncc/i2021-21082-9http://cds.cern.ch/record/2791317engVannoli, L3D pixel modules characterization with RD53A readout for ATLAS ITk UpgradeDetectors and Experimental TechniquesThe High-Luminosity LHC (HL-LHC) with its large number of collisions per bunch crossing will present a very challenging environment to the particle detectors. To cope with these conditions, the current inner detector of the ATLAS experiment will be replaced with a new all-silicon Inner Tracker (ITk) during the Phase-II upgrade. Due to their superior radiation hardness, it has been chosen to instrument the ITk innermost layer with 3D pixel sensors. In this article the new pixel 3D sensor design and technology are reviewed, together with their characterisation before and after exposition to large radiation dose, close to the one expected for the innermost layer of ITk after 2000 fb −1 of integrated luminosity delivered by HL-LHC.oai:cds.cern.ch:27913172021
spellingShingle Detectors and Experimental Techniques
Vannoli, L
3D pixel modules characterization with RD53A readout for ATLAS ITk Upgrade
title 3D pixel modules characterization with RD53A readout for ATLAS ITk Upgrade
title_full 3D pixel modules characterization with RD53A readout for ATLAS ITk Upgrade
title_fullStr 3D pixel modules characterization with RD53A readout for ATLAS ITk Upgrade
title_full_unstemmed 3D pixel modules characterization with RD53A readout for ATLAS ITk Upgrade
title_short 3D pixel modules characterization with RD53A readout for ATLAS ITk Upgrade
title_sort 3d pixel modules characterization with rd53a readout for atlas itk upgrade
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.1393/ncc/i2021-21082-9
http://cds.cern.ch/record/2791317
work_keys_str_mv AT vannolil 3dpixelmodulescharacterizationwithrd53areadoutforatlasitkupgrade